Senior Wide Band-Gap (WBG) Chip Engineer in Lincoln

We are exclusively representing a leading power semiconductor organisation looking to expand its engineering function.

Focusing specifically on WGB (wide band-gap) semiconductor devices, such as GaN-based and Ga2O3-based devices (amongst others).

The business is in receipt of significant investment to further strengthen its position within the global supply base of power semiconductors for industry applications across industrial to automotive.

The skillset required is as follows:

• 3 – 5 years of experience
• 2D/3D TCAD such as Silvaco or Synopsys
• Demonstrated experience in understanding and working with semiconductor device physics, such as Si IGBTs, SiC MOSFETs, FinFETs and SBDs.
• Knowledge of semiconductor fabrication processes.
• Characterisation experience using parameter analysers such as HP4156, Keysight B1500 series, Sony Curve tracer
• Ability to use layout tools to draw/view the chip layout
• Knowledge of reliability or high-voltage device behaviour (e.g. degradation, breakdown, leakage, thermal effects).
• Familiarity with SiC or GaN application environments (power conversion, inverters, power modules).

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