At a Glance
- Tasks: Design cutting-edge power modules using advanced semiconductor technologies.
- Company: Global leader in power semiconductor manufacturing with diverse market reach.
- Benefits: Competitive salary, on-site R&D environment, and exposure to innovative technologies.
- Other info: Opportunity for career growth in a leading-edge technology environment.
- Why this job: Join a dynamic team and work on impactful projects across various industries.
- Qualifications: Experience in power module design and knowledge of FEM and circuit simulation software.
The predicted salary is between 60000 - 80000 £ per year.
We exclusively represent a global leader in power semiconductor manufacturing who is seeking to expand its module engineering team due to the continued growth of the business. The business operates in diverse marketplaces, meaning its commercial successes are spread and not siloed to one industry. They sell into renewables, rail, HVDC and automotive marketplaces worldwide. The position is located on-site at their global Research and Development centre.
The position will expose you to leading-edge WBG and UWBG technology in addition to legacy, yet still very relevant technologies.
The required skillset is below:
- Design of power modules incorporating wide band gap semiconductors, for example GaN & SiC devices
- Embedded devices within multi-layer PCB stacks
- Optimising performance and switching performance by analysing magnetics, thermal characteristics, and EMI profiles
- Design and layout of high-power circuits taking into consideration commutation loop inductance minimisation, gate loop inductance minimisation and balancing, current sharing between devices and the minimisation of electromagnetic interference.
- System architecture mindset and experience
- Design for manufacture mindset and experience
- FEM software knowledge (ANSYS Mechanical and Q3D) and circuit simulation software (LTSpice, PLECS)
Principal Power Module Design Engineer in Lincoln employer: Clarion Chase
Contact Detail:
Clarion Chase Recruiting Team
StudySmarter Expert Advice 🤫
We think this is how you could land Principal Power Module Design Engineer in Lincoln
✨Tip Number 1
Network like a pro! Reach out to industry professionals on LinkedIn or attend relevant events. We can’t stress enough how personal connections can open doors that applications alone can’t.
✨Tip Number 2
Prepare for interviews by diving deep into the company’s projects and technologies. Show us you’re not just another candidate; demonstrate your passion for power semiconductors and how you can contribute to their growth.
✨Tip Number 3
Don’t shy away from showcasing your projects! Whether it’s through a portfolio or discussing past experiences, let us see your hands-on skills with GaN and SiC devices. Real-world examples speak volumes.
✨Tip Number 4
Apply directly through our website! It’s the best way to ensure your application gets noticed. Plus, we love seeing candidates who take the initiative to connect with us directly.
We think you need these skills to ace Principal Power Module Design Engineer in Lincoln
Some tips for your application 🫡
Tailor Your CV: Make sure your CV is tailored to the Principal Power Module Design Engineer role. Highlight your experience with power modules, especially with wide band gap semiconductors like GaN and SiC. We want to see how your skills match up with what we're looking for!
Showcase Relevant Projects: Include specific projects where you've designed high-power circuits or worked with embedded devices. We love seeing real examples of your work, so don’t hold back on the details that show off your expertise in optimising performance and minimising EMI.
Use Clear Language: Keep your application clear and concise. Use language that reflects the job description, especially when discussing your experience with FEM software and circuit simulation tools. We appreciate straightforward communication that gets to the point!
Apply Through Our Website: Don’t forget to apply through our website! It’s the best way for us to receive your application and ensures you’re considered for the role. Plus, it shows you’re keen to join our team at the global R&D centre!
How to prepare for a job interview at Clarion Chase
✨Know Your Tech Inside Out
Make sure you’re well-versed in the latest WBG and UWBG technologies, especially GaN and SiC devices. Brush up on your knowledge of embedded devices and multi-layer PCB stacks, as these will likely come up during the interview.
✨Showcase Your Design Skills
Prepare to discuss your experience with high-power circuit design. Be ready to explain how you've optimised performance by analysing magnetics, thermal characteristics, and EMI profiles in past projects. Real-world examples will make your answers stand out.
✨Familiarise Yourself with Software Tools
Since FEM software knowledge is crucial, ensure you can talk confidently about ANSYS Mechanical and Q3D. If you’ve used LTSpice or PLECS for circuit simulation, have specific examples ready to demonstrate your proficiency.
✨Think System Architecture
Adopt a system architecture mindset when discussing your previous work. Be prepared to explain how you approach design for manufacture and how you balance current sharing between devices while minimising electromagnetic interference.