Clarion Chase is seeking an experienced Mechanical Engineer for its international HQ and manufacturing site, focused on power module packaging for IGBT, SiC and GaN devices. You will design, prototype and qualify high-density modules with strong thermal performance.
The role requires hands-on CAD work (Solid Edge/SolidWorks), GD&T proficiency and FE A experience, with a manufacturing mindset and APQP/FMEA awareness.
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Lead Power Module Packaging Engineer for Next-Gen IGBT/SiC in Lincoln employer: Clarion Chase
As a leading global supplier of power semiconductor and power electronics solutions, our company offers an exceptional work environment that fosters innovation and professional growth. With a strong commitment to employee development and a collaborative culture, we empower our Procurement Managers to lead strategic initiatives that drive cost savings and enhance supply chain efficiency. Located in a dynamic industry, we provide unique opportunities to engage with international markets and contribute to sustainable advancements in various sectors.
