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- Tasks: Lead package design from concept to execution, optimising for performance and manufacturability.
- Company: Join Cisco Silicon One, a leader in innovative silicon solutions for next-gen networking.
- Benefits: Enjoy a collaborative culture, mentorship opportunities, and the chance to impact global networking.
- Why this job: Be part of a passionate team transforming how the world connects and learns.
- Qualifications: Bachelor's in Electrical Engineering; experience in ASIC package design and EDA tools required.
- Other info: Opportunity to mentor engineers and drive innovation in high-performance networking technologies.
The predicted salary is between 36000 - 60000 £ per year.
Join the Package Design Team at Cisco Silicon One in Armenia, a group leading the way in developing Cisco's groundbreaking silicon solutions for next-generation networking. As a collaborative team at the center of Cisco's silicon development, we design and optimize advanced package solutions for some of the industry’s most sophisticated ASICs. You’ll work directly with experts in layout, signal integrity, and power distribution, shaping innovative methodologies and driving the evolution of high-performance networking technologies.
Your Impact
This role offers a unique opportunity to make a significant impact on the future of networking innovation within the Cisco Silicon One initiative. As a lead engineer, you will drive the entire package design process—from planning and optimization to execution—ensuring the delivery of high-speed, robust, and scalable solutions for global networks. You will mentor engineers, define strategies, and collaborate across multi-functional teams to accelerate the creation of industry-leading silicon packages. Beyond technical leadership, you’ll join a passionate community dedicated to changing how the world connects, works, and learns, while building strong partnerships and fostering collective success.
Responsibilities
- Lead package design tasks, planning and driving schedules from concept through implementation
- Optimize package pinouts, stack-ups, power distribution, and high-speed routing, balancing performance and manufacturability
- Collaborate with silicon floor planning, signal integrity (SI), and power integrity (PI) teams to ensure design quality and efficiency
- Work closely with layout editors to deliver high-quality package designs aligned with interface requirements
- Enhance design methodologies and partner with vendors to improve product quality and efficiency
- Drive innovation in package solutions for Cisco’s next-generation ASICs
Minimum Qualifications
- Bachelor’s degree in Electrical Engineering or a related field
- Experience in ASIC package design, including optimizing pinouts, stack-ups, and high-speed routing
- Familiarity with relevant industry-standard EDA tools for layout and design for chip package development & simulations
- Practical experience in chip packaging processes, including vendor collaboration and management to ensure successful package development
- Strong understanding of high-speed signal design and power distribution networks (PDN)
- Strong analytical and problem-solving skills in debugging and optimizing package designs
Preferred Qualifications
- Master’s degree in Electrical Engineering
- Knowledge of silicon floor planning, signal integrity (SI), and power integrity (PI) considerations
- Proven track record to drive design improvements and lead stakeholder coordination throughout the design process
- Familiarity with advanced testing and measurement equipment, including oscilloscopes and TDR/VNA analyzers
Package Design Engineer. employer: Cisco
Contact Detail:
Cisco Recruiting Team
StudySmarter Expert Advice 🤫
We think this is how you could land Package Design Engineer.
✨Tip Number 1
Network with professionals in the ASIC package design field. Attend industry conferences, webinars, or local meetups to connect with experts and learn about the latest trends and technologies. This can help you gain insights into what Cisco is looking for and may even lead to referrals.
✨Tip Number 2
Familiarise yourself with Cisco's products and their impact on networking. Understanding their silicon solutions and how they fit into the broader market will allow you to speak knowledgeably during interviews and demonstrate your genuine interest in the company.
✨Tip Number 3
Showcase your collaborative skills by participating in relevant projects or open-source initiatives. Highlighting your ability to work effectively in multi-functional teams will resonate well with Cisco's emphasis on collaboration and innovation.
✨Tip Number 4
Prepare to discuss specific examples of your experience with high-speed signal design and power distribution networks. Being able to articulate your problem-solving process and the outcomes of your previous projects will set you apart as a strong candidate.
We think you need these skills to ace Package Design Engineer.
Some tips for your application 🫡
Tailor Your CV: Make sure your CV highlights relevant experience in ASIC package design, including any specific projects where you optimised pinouts or worked with high-speed routing. Use keywords from the job description to align your skills with what Cisco is looking for.
Craft a Compelling Cover Letter: In your cover letter, express your passion for networking innovation and how your background in Electrical Engineering makes you a great fit for the Package Design Team. Mention specific experiences that demonstrate your ability to lead design processes and collaborate with multi-functional teams.
Showcase Technical Skills: Highlight your familiarity with industry-standard EDA tools and any practical experience you have with chip packaging processes. Be specific about the tools you've used and how they contributed to successful package development in your previous roles.
Prepare for Potential Questions: Think about potential interview questions related to your experience in package design and your problem-solving skills. Be ready to discuss specific challenges you've faced and how you overcame them, particularly in relation to high-speed signal design and power distribution networks.
How to prepare for a job interview at Cisco
✨Showcase Your Technical Expertise
Be prepared to discuss your experience in ASIC package design, particularly focusing on optimising pinouts and high-speed routing. Highlight specific projects where you successfully implemented these skills, as this will demonstrate your capability to handle the technical demands of the role.
✨Demonstrate Collaborative Skills
Since the role involves working closely with multi-functional teams, share examples of past collaborations. Discuss how you’ve worked with layout editors or other engineering teams to enhance design quality, showcasing your ability to communicate effectively and drive collective success.
✨Prepare for Problem-Solving Scenarios
Expect to face questions that assess your analytical and problem-solving skills. Prepare to discuss specific challenges you’ve encountered in package design and how you approached debugging and optimisation. This will illustrate your critical thinking and adaptability.
✨Familiarise Yourself with Industry Tools
Make sure you are well-versed in the relevant EDA tools used for layout and design simulations. Being able to discuss your familiarity with these tools will show that you are ready to hit the ground running and can contribute to the team from day one.
