At a Glance
- Tasks: Design cutting-edge packaging solutions for high-performance products in a collaborative environment.
- Company: Join Cirrus Logic, a leader in mixed-signal processing with an award-winning culture.
- Benefits: Enjoy a supportive workplace with opportunities for growth and community engagement.
- Other info: Diversity and inclusion are at our core; we value every unique perspective.
- Why this job: Make a significant impact in a fast-paced, innovative environment while working with top engineers.
- Qualifications: BS in Engineering and experience in packaging design required; strong communication skills a must.
The predicted salary is between 50000 - 65000 € per year.
For over four decades, Cirrus Logic has been propelled by the top engineers in mixed-signal processing. Our rockstar team thrives on solving complex challenges with innovative end-user solutions for the world's top consumer brands. Cirrus Logic is also known for its award-winning culture, built on a foundation of inclusion and fairness, meaningful community engagement, and delivering enjoyable employee experiences at every turn. But we couldn’t do it without our extraordinary workforce – and that’s where you come in. Join our team and help us continue to make Cirrus Logic an exceptional place to grow your career! Are you ready to make a significant impact in a fast-paced, innovative environment? We are seeking a Staff Package Design Engineer to join our dynamic team in Edinburgh, UK. In this role, you’ll work closely with internal and external customers to develop cutting‑edge packaging solutions for high‑performance products including amplifiers, codecs, and DSPs. Our packaging technologies span from traditional wire‑bond QFN to advanced WLCSP and flip‑chip designs.
Main Responsibilities
- Collaborate with cross‑functional teams to drive package designs that meet Cirrus performance, reliability, and manufacturability requirements.
- Define package requirements from electrical, thermal, and mechanical point of view in close cooperation with Design and layout teams.
- Utilize AutoCAD, GDS tools, Siemens Fast3D and Cadence SiP Layout tool to complete physical design, electrical simulation and manufacturing validation solution for package design, including die bump array/BGA integration refinement using die information.
- Drive continuous improvement processes to assure accuracy between the interface of the package to the die and PCB.
- Work with cross functional teams (Customer, Designers, OSATs) to establish and maintain design rules for WLCSP, wire bond, and other packages.
- Understand DFM checking and modification to improve assembly yield and prevent manufacturing issues.
- Grow and promote automation processes throughout the package design flow.
- Develop test vehicles that properly assess bump placement, PCB proximity effects, WLCSP RDL stack up and the like on final chip performance.
- Close collaboration with customers to resolve various design issues between the piece part and PCB.
Required Skills And Qualifications
- BS or above in Mechanical, Electrical, Chemical, or Materials Engineering.
- Demonstrable experience in a packaging‑related field.
- Experienced Cadence SiP layout user.
- Strong AutoCAD user.
- Knowledge of packaging technologies, materials, package substrate design and assembly rules.
- Understanding of electrical simulation results on a package design.
- Familiarity or willingness to learn Cadence Virtuoso operation using Unix workstations.
- Strong written and verbal communication skills; able to review technical ideas with customers and high‑level management.
- Self‑starter with a strong sense of ownership and accountability for driving projects to completion.
- Ability to build strong, influential relationships in a collaborative environment within a diverse setting.
Preferred Skills And Qualifications
- Conversant with PCB and Die mechanical layout tools (e.g. Siemens Xpedition, Allegro PCB, Cadence Virtuoso).
- Broad reading in the area of interest and the desire to continue that reading with access to the high quality company library resource, material properties knowledge.
- Must be broadly curious and knowledgeable, and willing to pursue mastery of new technical concepts through self‑learning or training opportunities available through company resources.
- Electrical simulation skills.
- Experience using Siemens Fast 3D.
- Experience using Siemens Calibre DRV.
This position is based in our Edinburgh office, UK. You must be based within commutable distance of the work location listed on the job posting, or willing to relocate prior to beginning employment with Cirrus Logic.
Export Control Restrictions
Export control restrictions based upon applicable laws and regulations would prohibit candidates who are nationals of certain embargoed countries from working in this position without Cirrus Logic first obtaining an export license. Candidates for this role must be able to access technical data without a requirement for an export license. We are unable to sponsor or obtain export licenses for this role.
Diversity & Inclusion Statement
At Cirrus Logic, we believe that diversity drives innovation, and we are committed to encouraging an open and collaborative culture where different approaches, ideas, and points of view are respected and valued. We aim to promote a workplace where everyone can contribute irrespective of race, colour, national origin, religion or belief, gender or gender identity, sexual orientation, age, marital status, pregnancy status, or disability.
Staff Package Design Engineer employer: Cirrus Logic
Cirrus Logic is an exceptional employer that fosters a vibrant and inclusive work culture, where innovation thrives and employees are empowered to make a meaningful impact. Located in the heart of Edinburgh, our team enjoys a collaborative environment with ample opportunities for professional growth, supported by a commitment to community engagement and employee well-being. Join us to be part of a forward-thinking company that values diversity and encourages continuous learning in the exciting field of mixed-signal processing.
StudySmarter Expert Advice🤫
We think this is how you could land Staff Package Design Engineer
✨Tip Number 1
Network like a pro! Reach out to current or former employees at Cirrus Logic on LinkedIn. A friendly chat can give you insider info and maybe even a referral, which can really boost your chances.
✨Tip Number 2
Prepare for the interview by brushing up on your technical skills. Make sure you can discuss packaging technologies and tools like AutoCAD and Cadence SiP layout confidently. We want to see your passion and expertise shine through!
✨Tip Number 3
Show off your collaborative spirit! Cirrus Logic values teamwork, so be ready to share examples of how you've worked with cross-functional teams in the past. Highlighting your ability to build strong relationships will set you apart.
✨Tip Number 4
Don’t forget to apply through our website! It’s the best way to ensure your application gets seen by the right people. Plus, it shows you’re genuinely interested in joining our awesome team at Cirrus Logic.
We think you need these skills to ace Staff Package Design Engineer
Some tips for your application 🫡
Tailor Your Application:Make sure to customise your CV and cover letter for the Staff Package Design Engineer role. Highlight your relevant experience with packaging technologies and tools like AutoCAD and Cadence SiP layout, as this will show us you’re a great fit for our team.
Show Off Your Skills:Don’t just list your skills; demonstrate them! Use specific examples from your past work that showcase your expertise in package design and collaboration with cross-functional teams. We love seeing how you’ve tackled challenges in your previous roles.
Be Clear and Concise:When writing your application, keep it clear and to the point. We appreciate well-structured applications that are easy to read. Avoid jargon unless it’s relevant to the role, and make sure to proofread for any typos or errors.
Apply Through Our Website:We encourage you to apply directly through our website. It’s the best way for us to receive your application and ensures you’re considered for the role. Plus, you’ll find all the details you need about the position there!
How to prepare for a job interview at Cirrus Logic
✨Know Your Packaging Technologies
Make sure you brush up on the various packaging technologies mentioned in the job description, like wire-bond QFN and WLCSP. Being able to discuss these in detail will show your expertise and enthusiasm for the role.
✨Showcase Your Software Skills
Familiarise yourself with the tools listed, such as AutoCAD and Cadence SiP Layout. If you have experience using them, be ready to share specific examples of how you've used these tools in past projects to solve design challenges.
✨Prepare for Collaboration Questions
Since the role involves working closely with cross-functional teams, think of examples where you've successfully collaborated with others. Highlight your communication skills and how you’ve built strong relationships in diverse settings.
✨Demonstrate Continuous Improvement Mindset
Cirrus Logic values innovation and improvement, so come prepared with ideas on how you would drive continuous improvement processes in package design. This could include automation processes or ways to enhance accuracy in designs.