At a Glance
- Tasks: Design cutting-edge packaging solutions for high-performance products in a collaborative environment.
- Company: Join Cirrus Logic, a leader in mixed-signal processing with an award-winning culture.
- Benefits: Enjoy hybrid work options, a supportive team, and opportunities for personal growth.
- Why this job: Make a significant impact while working on innovative projects with top consumer brands.
- Qualifications: BS in Engineering and experience in packaging design; strong communication skills required.
- Other info: This role is based in Edinburgh, UK, with a flexible in-office schedule.
The predicted salary is between 36000 - 60000 £ per year.
For over four decades, Cirrus Logic has been propelled by the top engineers in mixed-signal processing. Our rockstar team thrives on solving complex challenges with innovative end-user solutionsfor the world\’s top consumer brands. Cirrus Logic is also known for its award-winning culture, built on a foundation of inclusion and fairness, meaningful community engagement, and delivering enjoyable employee experiences at every turn. But we couldn’t do it without our extraordinary workforce – and that’s where you come in. Join our team and help us continue to make Cirrus Logic an exceptional place to grow your career!
Are you ready to make a significant impact in a fast-paced, innovative environment?
We are seeking aStaff Package Design Engineerto join our dynamic team in Edinburgh, UK. In this role, you’ll work closely with internal and external customers to develop cutting-edge packaging solutions for high-performance products including amplifiers, codecs, and DSPs. Our packaging technologies span from traditional wire-bond QFN to advanced WLCSP and flip-chip designs.
Responsibilities:
- Collaborate with cross-functional teams to drive package designs that meets Cirrus performance, reliability, and manufacturability requirements
- Define package requirements from electrical, thermal, and mechanical point of view in close cooperation with Design and layout teams
- Utilize AutoCAD, GDS tools, Siemen Fast3D and Cadence SiP Layout tool to complete physical design, electrical simulation and manufacturing validation solution for package design, including die bump array/BGA integration refinement using die information
- Drive continuous improvement processes to assure accuracy between the interface of the package to the die and PCB
- Work with cross functional teams (Customer, Designers, OSATs) to establish and maintain design rules for WLCSP, wire bond, and other packages
- Understand DFM checking and modification to improve assembly yield and prevent manufacturing issues
- Grow and promote automation processes throughout the package design flow
- Develop test vehicles that properly assess bump placement, PCB proximity effects, WLCSP RDL stack up and the like on final chip performance
- Close collaboration with customers to resolve various design issues between the piece part and PCB
Required Skills and Qualifications:
- BS or above in Mechanical, Electrical, Chemical, or Materials Engineering
- Demonstrable experience in a packaging-related field
- Experienced Cadence SiP layout user
- Strong AutoCAD user
- Knowledge of packaging technologies, materials, package substrate design and assembly rules
- Understanding of electrical simulation results on a package design
- Familiarity or willingness to learn Cadence Virtuoso operation using Unix workstations
- Strong written and verbal communication skills; able to review technical ideas with customers and high-level management
- Self-starter with a strong sense of ownership and accountability for driving projects to completion
- Ability to build strong, influential relationships in a collaborative environment within a diverse setting
Preferred Skills and Qualifications:
- Conversant with PCB and Die mechanical layout tools (e.g. Siemens Xpedition, Allegro PCB, Cadence Virtuoso)
- Broad reading in the area of interest and the desire to continue that reading with access to the high quality company library resource, material properties knowledge
- Must be broadly curious and knowledgeable, and willing to pursue mastery of new technical concepts through self-learning or training opportunities available through company resources
- Electrical simulation skills
- Experience using Siemens Fast 3D
- Experience using Siemens Calibre DRV
This position is based in Edinburgh, UK
This is a hybrid remote position and will follow a 2+ day in-office work schedule, with in-office days based on business needs and team preference. You must be based within commutable distance of the work location listed on the job posting, or willing to relocate prior to beginning employment with Cirrus Logic.
#LI-PD1
#LI-Hybrid
At Cirrus Logic, we believe that diversity drives innovation, and we are committed to encouraging an open and collaborative culture where different approaches, ideas, and points of view are respected and valued. We aim to promote a workplace where everyone can contribute irrespective of race, colour, national origin, religion or belief, gender or gender identity, sexual orientation, age, marital status, pregnancy status, or disability.
#J-18808-Ljbffr
Staff NPI Package Design Engineer employer: Cirrus Logic
Contact Detail:
Cirrus Logic Recruiting Team
StudySmarter Expert Advice 🤫
We think this is how you could land Staff NPI Package Design Engineer
✨Tip Number 1
Familiarise yourself with the specific packaging technologies mentioned in the job description, such as WLCSP and flip-chip designs. Understanding these technologies will not only help you during interviews but also demonstrate your genuine interest in the role.
✨Tip Number 2
Network with current or former employees of Cirrus Logic on platforms like LinkedIn. Engaging with them can provide you with insider knowledge about the company culture and expectations, which can be invaluable during your application process.
✨Tip Number 3
Brush up on your skills with the software tools listed in the job description, particularly Cadence SiP Layout and AutoCAD. Consider taking online courses or tutorials to enhance your proficiency, as this will give you a competitive edge.
✨Tip Number 4
Prepare to discuss your experience with cross-functional collaboration. Think of specific examples where you've successfully worked with diverse teams, as this aligns with Cirrus Logic's emphasis on teamwork and communication.
We think you need these skills to ace Staff NPI Package Design Engineer
Some tips for your application 🫡
Tailor Your CV: Make sure your CV highlights relevant experience in packaging design and engineering. Emphasise your skills with tools like AutoCAD and Cadence SiP layout, as well as any experience with electrical simulation results.
Craft a Compelling Cover Letter: In your cover letter, express your enthusiasm for the role at Cirrus Logic. Mention specific projects or experiences that demonstrate your ability to collaborate with cross-functional teams and drive package designs.
Showcase Your Technical Skills: Clearly outline your technical skills related to packaging technologies and materials. If you have experience with DFM checking or automation processes, be sure to include that as it aligns with the job requirements.
Highlight Soft Skills: Cirrus Logic values strong communication and collaboration. Provide examples of how you've built influential relationships in previous roles and how you approach problem-solving in a team environment.
How to prepare for a job interview at Cirrus Logic
✨Know Your Packaging Technologies
Familiarise yourself with various packaging technologies mentioned in the job description, such as wire-bond QFN, WLCSP, and flip-chip designs. Be prepared to discuss how your experience aligns with these technologies and how you can contribute to innovative solutions.
✨Demonstrate Technical Proficiency
Highlight your experience with tools like AutoCAD, Cadence SiP Layout, and Siemens Fast3D during the interview. Be ready to provide examples of how you've used these tools in past projects to solve complex design challenges.
✨Showcase Collaboration Skills
Cirrus Logic values teamwork, so be prepared to discuss instances where you've successfully collaborated with cross-functional teams. Emphasise your ability to build strong relationships and communicate effectively with both technical and non-technical stakeholders.
✨Express a Growth Mindset
Convey your eagerness to learn and adapt, especially regarding new technical concepts and tools. Mention any self-learning initiatives or training opportunities you've pursued, demonstrating your commitment to continuous improvement and mastery in your field.