Staff Package Design Engineer

Are you ready to make a significant impact in a fast-paced, innovative environment? We are seeking a Staff Package Design Engineer to join our dynamic team in Edinburgh, UK. In this role, you’ll work closely with internal and external customers to develop cutting‑edge packaging solutions for high-performance products including amplifiers, codecs, and DSPs. Our packaging technologies span from traditional wire‑bond QFN to advanced WLCSP and flip‑chip designs.

Main Responsibilities

• Collaborate with cross‑functional teams to drive package designs that meet Cirrus performance, reliability, and manufacturability requirements.
• Define package requirements from electrical, thermal, and mechanical point of view in close cooperation with Design and layout teams.
• Utilize AutoCAD, GDS tools, Siemens Fast3D and Cadence SiP Layout tool to complete physical design, electrical simulation and manufacturing validation solution for package design, including die bump array/BGA integration refinement using die information.
• Drive continuous improvement processes to assure accuracy between the interface of the package to the die and PCB.
• Work with cross functional teams (Customer, Designers, OSATs) to establish and maintain design rules for WLCSP, wire bond, and other packages.
• Understand DFM checking and modification to improve assembly yield and prevent manufacturing issues.
• Grow and promote automation processes throughout the package design flow.
• Develop test vehicles that properly assess bump placement, PCB proximity effects, WLCSP RDL stack up and the like on final chip performance.
• Close collaboration with customers to resolve various design issues between the piece part and PCB.

Required Skills and Qualifications

• BS or above in Mechanical, Electrical, Chemical, or Materials Engineering.
• Demonstrable experience in a packaging-related field.
• Experienced Cadence SiP layout user.
• Strong AutoCAD user.
• Knowledge of packaging technologies, materials, package substrate design and assembly rules.
• Understanding of electrical simulation results on a package design.
• Familiarity or willingness to learn Cadence Virtuoso operation using Unix workstations.
• Strong written and verbal communication skills; able to review technical ideas with customers and high-level management.
• Self‑starter with a strong sense of ownership and accountability for driving projects to completion.
• Ability to build strong, influential relationships in a collaborative environment within a diverse setting.

Preferred Skills and Qualifications

• Conversant with PCB and Die mechanical layout tools (e.g. Siemens Xpedition, Allegro PCB, Cadence Virtuoso).
• Broad reading in the area of interest and the desire to continue that reading with access to the high quality company library resource, material properties knowledge.
• Must be broadly curious and knowledgeable, and willing to pursue mastery of new technical concepts through self‑learning or training opportunities available through company resources.
• Electrical simulation skills.
• Experience using Siemens Fast 3D.
• Experience using Siemens Calibre DRV.

This position is based in our Edinburgh office, UK. You must be based within commutable distance of the work location listed on the job posting, or willing to relocate prior to beginning employment with Cirrus Logic.