Staff NPI Package Design Engineer
Staff NPI Package Design Engineer

Staff NPI Package Design Engineer

Full-Time 48000 - 72000 £ / year (est.) No home office possible
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At a Glance

  • Tasks: Design cutting-edge packaging solutions for high-performance products in a collaborative environment.
  • Company: Join Cirrus Logic, a leader in mixed-signal processing with an award-winning culture.
  • Benefits: Enjoy hybrid work options, a supportive team, and opportunities for personal growth.
  • Why this job: Make a significant impact in a fast-paced, innovative setting while working with top consumer brands.
  • Qualifications: BS in Engineering and experience in packaging design required; strong communication skills essential.
  • Other info: This role is based in Edinburgh, UK, with a flexible in-office schedule.

The predicted salary is between 48000 - 72000 £ per year.

For over four decades, Cirrus Logic has been propelled by the top engineers in mixed-signal processing. Our rockstar team thrives on solving complex challenges with innovative end-user solutionsfor the world\’s top consumer brands. Cirrus Logic is also known for its award-winning culture, built on a foundation of inclusion and fairness, meaningful community engagement, and delivering enjoyable employee experiences at every turn. But we couldn’t do it without our extraordinary workforce – and that’s where you come in. Join our team and help us continue to make Cirrus Logic an exceptional place to grow your career!

Are you ready to make a significant impact in a fast-paced, innovative environment?

We are seeking aStaff Package Design Engineerto join our dynamic team in Edinburgh, UK. In this role, you’ll work closely with internal and external customers to develop cutting-edge packaging solutions for high-performance products including amplifiers, codecs, and DSPs. Our packaging technologies span from traditional wire-bond QFN to advanced WLCSP and flip-chip designs.

Responsibilities:

  • Collaborate with cross-functional teams to drive package designs that meets Cirrus performance, reliability, and manufacturability requirements
  • Define package requirements from electrical, thermal, and mechanical point of view in close cooperation with Design and layout teams
  • Utilize AutoCAD, GDS tools, Siemen Fast3D and Cadence SiP Layout tool to complete physical design, electrical simulation and manufacturing validation solution for package design, including die bump array/BGA integration refinement using die information
  • Drive continuous improvement processes to assure accuracy between the interface of the package to the die and PCB
  • Work with cross functional teams (Customer, Designers, OSATs) to establish and maintain design rules for WLCSP, wire bond, and other packages
  • Understand DFM checking and modification to improve assembly yield and prevent manufacturing issues
  • Grow and promote automation processes throughout the package design flow
  • Develop test vehicles that properly assess bump placement, PCB proximity effects, WLCSP RDL stack up and the like on final chip performance
  • Close collaboration with customers to resolve various design issues between the piece part and PCB

Required Skills and Qualifications:

  • BS or above in Mechanical, Electrical, Chemical, or Materials Engineering
  • Demonstrable experience in a packaging-related field
  • Experienced Cadence SiP layout user
  • Strong AutoCAD user
  • Knowledge of packaging technologies, materials, package substrate design and assembly rules
  • Understanding of electrical simulation results on a package design
  • Familiarity or willingness to learn Cadence Virtuoso operation using Unix workstations
  • Strong written and verbal communication skills; able to review technical ideas with customers and high-level management
  • Self-starter with a strong sense of ownership and accountability for driving projects to completion
  • Ability to build strong, influential relationships in a collaborative environment within a diverse setting

Preferred Skills and Qualifications:

  • Conversant with PCB and Die mechanical layout tools (e.g. Siemens Xpedition, Allegro PCB, Cadence Virtuoso)
  • Broad reading in the area of interest and the desire to continue that reading with access to the high quality company library resource, material properties knowledge
  • Must be broadly curious and knowledgeable, and willing to pursue mastery of new technical concepts through self-learning or training opportunities available through company resources
  • Electrical simulation skills
  • Experience using Siemens Fast 3D
  • Experience using Siemens Calibre DRV

This position is based in Edinburgh, UK

This is a hybrid remote position and will follow a 2+ day in-office work schedule, with in-office days based on business needs and team preference. You must be based within commutable distance of the work location listed on the job posting, or willing to relocate prior to beginning employment with Cirrus Logic.

#LI-PD1

#LI-Hybrid

At Cirrus Logic, we believe that diversity drives innovation, and we are committed to encouraging an open and collaborative culture where different approaches, ideas, and points of view are respected and valued. We aim to promote a workplace where everyone can contribute irrespective of race, colour, national origin, religion or belief, gender or gender identity, sexual orientation, age, marital status, pregnancy status, or disability.

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Staff NPI Package Design Engineer employer: Cirrus Logic, Inc.

Cirrus Logic is an exceptional employer that fosters a vibrant and inclusive work culture in Edinburgh, UK, where innovation thrives. Employees benefit from meaningful community engagement, opportunities for professional growth, and a collaborative environment that values diverse perspectives. With a commitment to employee experiences and continuous improvement, Cirrus Logic offers a unique chance to make a significant impact in the fast-paced world of mixed-signal processing.
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Contact Detail:

Cirrus Logic, Inc. Recruiting Team

StudySmarter Expert Advice 🤫

We think this is how you could land Staff NPI Package Design Engineer

✨Tip Number 1

Familiarise yourself with the specific packaging technologies mentioned in the job description, such as WLCSP and flip-chip designs. Understanding these technologies will not only help you during interviews but also demonstrate your genuine interest in the role.

✨Tip Number 2

Network with current or former employees of Cirrus Logic on platforms like LinkedIn. Engaging with them can provide you with insider knowledge about the company culture and expectations, which can be invaluable during your application process.

✨Tip Number 3

Brush up on your skills with AutoCAD and Cadence SiP layout tools, as these are crucial for the role. Consider taking online courses or tutorials to enhance your proficiency, which will make you a more attractive candidate.

✨Tip Number 4

Prepare to discuss your experience with cross-functional collaboration. Think of specific examples where you've successfully worked with diverse teams, as this aligns with Cirrus Logic's emphasis on teamwork and communication.

We think you need these skills to ace Staff NPI Package Design Engineer

Mechanical Engineering
Electrical Engineering
Chemical Engineering
Materials Engineering
Packaging Technologies
AutoCAD Proficiency
Cadence SiP Layout Tool Experience
DFM Checking and Modification
Electrical Simulation Understanding
Strong Written and Verbal Communication Skills
Project Management
Collaboration Skills
Problem-Solving Skills
Continuous Improvement Processes
Ability to Build Influential Relationships

Some tips for your application 🫡

Tailor Your CV: Make sure your CV highlights relevant experience in packaging design and engineering. Emphasise your skills with tools like AutoCAD and Cadence SiP Layout, as well as any experience with electrical simulation and DFM checking.

Craft a Compelling Cover Letter: In your cover letter, express your enthusiasm for the role at Cirrus Logic. Mention specific projects or experiences that demonstrate your ability to collaborate with cross-functional teams and drive package designs that meet performance and reliability requirements.

Showcase Your Technical Skills: Be sure to include any technical skills that align with the job description, such as familiarity with PCB and die mechanical layout tools, and your experience with Siemens Fast 3D. Highlight your willingness to learn new tools like Cadence Virtuoso.

Demonstrate Soft Skills: Cirrus Logic values strong communication and collaboration skills. Provide examples in your application of how you've built influential relationships in previous roles and how you approach problem-solving in a team environment.

How to prepare for a job interview at Cirrus Logic, Inc.

✨Showcase Your Technical Skills

Be prepared to discuss your experience with packaging technologies and tools like AutoCAD and Cadence SiP Layout. Highlight specific projects where you successfully applied these skills, as this will demonstrate your capability to meet the technical demands of the role.

✨Emphasise Collaboration

Cirrus Logic values teamwork, so be ready to share examples of how you've worked with cross-functional teams in the past. Discuss how you’ve collaborated with designers, customers, and other stakeholders to drive successful package designs.

✨Demonstrate Problem-Solving Abilities

Prepare to talk about challenges you've faced in previous roles, particularly those related to package design and manufacturing issues. Explain how you approached these problems and what solutions you implemented, showcasing your analytical thinking.

✨Express Your Passion for Learning

Cirrus Logic appreciates candidates who are eager to grow and learn. Share your enthusiasm for mastering new technical concepts and any self-learning initiatives you've undertaken. This will show that you're proactive and committed to continuous improvement.

Staff NPI Package Design Engineer
Cirrus Logic, Inc.
C
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