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- Tasks: Lead innovative semiconductor packaging projects and develop cutting-edge integration technologies.
- Company: Join CSA Catapult, a leader in R&D for advanced semiconductor solutions.
- Benefits: Enjoy competitive pay, flexible working options, and opportunities for professional growth.
- Why this job: Be at the forefront of technology, making an impact in AI and photonics systems.
- Qualifications: Expertise in microelectronics assembly and prior experience in semiconductor packaging is essential.
- Other info: Mentorship opportunities available; collaborate with diverse teams and industry partners.
The predicted salary is between 48000 - 72000 £ per year.
CSA Catapult requires a Senior Packaging Process Engineer to work in a challenging R&D environment to explore and develop disruptive semiconductor packaging and integration technologies with a strong background in 3D and 2.5D integration, high-speed interconnects, and advanced semiconductor packaging. This role is pivotal in driving the development of cutting-edge packaging solutions for next-generation systems in AI, co-packaged RF and photonics systems.
The Senior Packaging Process Engineer shall be a subject matter expert/ specialist leading a projectteam of multidisciplinary engineers to deliver complex integration projects, enabling heterogeneous system-in-package (SiP) platforms and performance-optimized device architectures.
The Senior Engineer is expected to have expert knowledge in microelectronics assembly and validation, and broad knowledge of semiconductor package engineering, science and technology with prior experience. They will be applying their knowledge to solve the semiconductor assembly and bonding challenges in advanced packaging of CS products using a wide range of bonding materials. They will support planning projects, bid preparation, technical proposals and quotations, working closely with the bid team and commercial team.
Key responsibilities include:
- Lead the development of advanced packaging assembly processes, focusing on 3D/2.5D integration, high-density interposers, and high-speed interconnect solutions (e.g., micro-bumps, hybrid bonding, through-silicon vias)
- Design and validate high-speed interconnect solutions as part of heterogeneous integration and system-in-package (SiP) platforms
- Define and validate interconnect schemes (fine-pitch flip chip, wafer-level packaging, hybrid bonding) to meet electrical, thermal, and mechanical performance targets
- Develop robust assembly process flows, including die attach, underfill, bonding, and encapsulation for 3D stacked and interposer-based packages
- Lead design-for-manufacturing (DFM) activities in collaboration with internal and external design and product development teams
- Drive technical DOEs, reliability testing, failure analysis, and statistical process control for advanced packaging
- Interface with technology partners, equipment vendors, and customers to evaluate and implement state-of-the-art materials and tools (e.g., low-loss dielectrics, ultra-fine-pitch interconnects)
- Lead lab-based activities including equipment setup, process characterization, prototyping, and DOEs using tools such as die bonders, sinter presses, wire bonders, and plasma cleaners
- Lead project teams, contribute to bid proposals, technical plans, and funding applications
- Act as a technical authority across multiple packaging projects, mentoring junior engineers and collaborating with cross-functional teams
- Support the preparation of technical documentation, including work instructions, process flow diagrams, and qualification reports
- Interface with commercial, R&D, and customer teams to ensure alignment of assembly processes with program goals
- Contribute to the development of scale-up plans and futureproofing strategies for process industrialization and facility readiness
- Contribute to the strategic roadmap for CSA Catapult’s advanced packaging capability
- Present results and work to wide audiences to enhance the reputation of the Catapult
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Senior Packaging Process Engineer employer: Catapult
Contact Detail:
Catapult Recruiting Team
StudySmarter Expert Advice 🤫
We think this is how you could land Senior Packaging Process Engineer
✨Tip Number 1
Network with professionals in the semiconductor packaging field. Attend industry conferences, webinars, and workshops to meet potential colleagues and learn about the latest trends and technologies. This can help you gain insights into what CSA Catapult values in their candidates.
✨Tip Number 2
Familiarise yourself with the specific technologies mentioned in the job description, such as 3D/2.5D integration and high-speed interconnects. Being able to discuss these topics confidently during interviews will demonstrate your expertise and enthusiasm for the role.
✨Tip Number 3
Prepare to showcase your leadership skills and experience in managing multidisciplinary teams. Think of examples from your past work where you successfully led projects or mentored junior engineers, as this is a key aspect of the Senior Packaging Process Engineer role.
✨Tip Number 4
Research CSA Catapult's recent projects and initiatives in advanced packaging. Understanding their current focus areas will allow you to tailor your discussions and show how your background aligns with their goals, making you a more attractive candidate.
We think you need these skills to ace Senior Packaging Process Engineer
Some tips for your application 🫡
Tailor Your CV: Make sure your CV highlights relevant experience in semiconductor packaging, 3D/2.5D integration, and high-speed interconnects. Use specific examples from your past roles that demonstrate your expertise in these areas.
Craft a Compelling Cover Letter: Write a cover letter that showcases your passion for R&D in semiconductor technologies. Mention how your background aligns with the responsibilities of the Senior Packaging Process Engineer role and express your enthusiasm for contributing to CSA Catapult's innovative projects.
Highlight Technical Skills: In your application, emphasise your technical skills related to microelectronics assembly, bonding materials, and design-for-manufacturing (DFM). Be specific about the tools and processes you have experience with, such as die bonders and reliability testing.
Showcase Leadership Experience: Since this role involves leading project teams, include examples of your leadership experience. Discuss any previous roles where you mentored junior engineers or led cross-functional teams to deliver complex projects successfully.
How to prepare for a job interview at Catapult
✨Showcase Your Expertise
Make sure to highlight your extensive knowledge in microelectronics assembly and semiconductor packaging during the interview. Be prepared to discuss specific projects where you've successfully implemented 3D and 2.5D integration techniques.
✨Demonstrate Problem-Solving Skills
Prepare examples of how you've tackled complex challenges in semiconductor assembly and bonding. Discuss the methodologies you used, such as design-for-manufacturing (DFM) activities or reliability testing, to showcase your analytical skills.
✨Engage with Technical Questions
Expect technical questions related to high-speed interconnects and advanced packaging solutions. Brush up on the latest technologies and be ready to explain how you would approach designing and validating interconnect schemes.
✨Highlight Team Collaboration
Since this role involves leading multidisciplinary teams, emphasise your experience in mentoring junior engineers and collaborating with cross-functional teams. Share instances where your leadership contributed to successful project outcomes.
