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- Tasks: Join a team to innovate packaging technologies for next-gen semiconductor systems.
- Company: Leading R&D firm focused on advanced semiconductor solutions.
- Benefits: Competitive salary, flexible hours, and opportunities for hands-on experience.
- Why this job: Make a real impact in the tech world while developing cutting-edge packaging processes.
- Qualifications: Background in engineering or related fields with a passion for technology.
- Other info: Dynamic work environment with great potential for career advancement.
The predicted salary is between 36000 - 60000 £ per year.
Reporting to the Engineering Manager, the Packaging Process Engineer will work in a challenging R&D environment to explore and develop disruptive packaging and integration technologies to make next-generation systems more energy and packaging efficient.The Process Engineer will work with a team of multidisciplinary engineers to develop novel semiconductor chip assembly and integration processes for advanced packaging of compound semiconductor-based devices, modules and systems.They will apply their knowledge to solve the assembly and bonding challenges in the advanced packaging of compound semiconductor products using a wide range of die and wire bonding materials. Key responsibilities include:Participate in the Semiconductor packaging, assembly process development, prototyping, and bill of materials (BOM) strategies for single die, multi-die or system in package (SIP) packaging solutions for power electronics/ RF/ PhotonicsProvide package design inputs, material selection and assembly process development for a number of different semiconductor packagesFollow the semiconductor/ micro-electronic package process flow, material set, test vehicle, DOEs, process control plans to successfully develop manufacturable and reliable packaging processes such as Die attach technologies, Flip-Chip, hybrid bonding, Wire bond , SIP (System in Package)R&D of assembly interconnects and interfacesSemiconductor package prototyping, testing, reliability & failure analysisDevelop semiconductor assembly process of interpreting reports derived from design of experiments (DOEs) and ensure all potential obstacles are identified and provide mitigation plans for identified issuesWork with internal design and products teams and drive design for manufacturing (DFM) methodology for new technologiesActively research to resolve semiconductor assembly interconnect challenges through developing new integration schemes and characterisation of novel packaging architectures involving highly technical and scientific methodsStudy microelectronics assembly process, bonding materials and apply the knowledge to develop advanced interconnects for compound semiconductor device and module packagingGather customer requirements and follow procedures to build assembly process relevant to the project work.Conduct experiments to determine material properties and relate these to project workUse results from simulations and experiments to aid package designOperate key assembly equipment and undertake process and SOP developmentGenerate technical reports on results and conclusions drawn from experiments conducted and incorporate findings in formal specificationsEstimate set-up times, flow-times, costs of production and acceptance equipmentAs needed, performs support functions for project planning to achieve quality, delivery schedules, and cost objectivesWork closely with suppliers providing technical specifications and procuring components and test equipment to specification and budgetParticipate in technical risk assessments
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Process Engineer employer: Catapult
Contact Detail:
Catapult Recruiting Team
StudySmarter Expert Advice 🤫
We think this is how you could land Process Engineer
✨Tip Number 1
Network like a pro! Reach out to professionals in the semiconductor and packaging industry on LinkedIn. Join relevant groups, attend webinars, and don’t be shy to ask for informational interviews. We all know that sometimes it’s not just what you know, but who you know!
✨Tip Number 2
Prepare for those tricky technical interviews! Brush up on your knowledge of die attach technologies, Flip-Chip, and hybrid bonding. We recommend doing mock interviews with friends or using online platforms to simulate the experience. The more you practice, the more confident you'll feel!
✨Tip Number 3
Showcase your projects! If you've worked on any relevant R&D projects or have experience with semiconductor packaging, make sure to highlight these in your conversations. We love seeing real-world applications of your skills, so bring your A-game when discussing your past work.
✨Tip Number 4
Don’t forget to apply through our website! It’s the best way to ensure your application gets seen by the right people. Plus, we’re always looking for passionate individuals who are eager to innovate in the packaging process engineering space. Let’s make it happen together!
We think you need these skills to ace Process Engineer
Some tips for your application 🫡
Tailor Your CV: Make sure your CV is tailored to the Process Engineer role. Highlight your experience with semiconductor packaging and any relevant projects you've worked on. We want to see how your skills align with our needs!
Craft a Compelling Cover Letter: Your cover letter is your chance to shine! Use it to explain why you're passionate about R&D in packaging technologies and how you can contribute to our team. Keep it engaging and relevant to the job description.
Showcase Your Technical Skills: Don’t forget to showcase your technical skills related to die attach technologies, bonding materials, and process development. We love seeing candidates who can demonstrate their knowledge and experience in these areas!
Apply Through Our Website: We encourage you to apply through our website for a smoother application process. It helps us keep track of your application and ensures you don’t miss out on any important updates from us!
How to prepare for a job interview at Catapult
✨Know Your Stuff
Make sure you brush up on your knowledge of semiconductor packaging and assembly processes. Familiarise yourself with die attach technologies, Flip-Chip, and SIP solutions. Being able to discuss these topics confidently will show that you're serious about the role.
✨Showcase Your Problem-Solving Skills
Prepare examples of how you've tackled challenges in previous projects, especially those related to bonding materials or assembly processes. Use the STAR method (Situation, Task, Action, Result) to structure your answers and highlight your analytical skills.
✨Ask Smart Questions
Come prepared with insightful questions about the company's current projects or their approach to R&D in packaging technologies. This not only shows your interest but also gives you a chance to demonstrate your understanding of the industry.
✨Be a Team Player
Since you'll be working with a multidisciplinary team, emphasise your collaborative experiences. Share instances where you successfully worked with others to achieve project goals, and express your enthusiasm for contributing to a team environment.
