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- Tasks: Lead and design innovative semiconductor packaging solutions for cutting-edge technologies.
- Company: CSA Catapult is a leader in semiconductor innovation, driving advancements in technology.
- Benefits: Enjoy hands-on lab experience, collaborative projects, and opportunities for professional growth.
- Why this job: Join a dynamic team shaping the future of AI, HPC, and photonics with impactful technology.
- Qualifications: Deep expertise in semiconductor packaging and systems-level design required.
- Other info: Engage with global partners and contribute to groundbreaking R&D initiatives.
The predicted salary is between 72000 - 108000 £ per year.
CSA Catapult is seeking a Principal Semiconductor Packaging Engineer to lead and architect cutting-edge 3D and 2.5D semiconductor packaging technologies, including advanced interconnects, system-in-package (SiP), chiplet integration, and high-bandwidth interface packaging. This is a strategic technical role combining deep packaging expertise with systems-level design thinking to define and deliver next-generation packaging platforms.
As a senior technical authority, you will lead internal and collaborative R&D programs and interface with global industry and academic partners to deliver packaging solutions for heterogeneous integration, targeting applications in AI, HPC, power electronics, RF, and photonics. You will be expected to provide design expertise on projects, analysis, assembly, and technical guidance on test and validation activities, participating in labs at Catapult’s Innovation Centre.
This position drives all packaging aspects of prototype/product development by charting and enabling packaging technology roadmaps in collaboration with internal and external stakeholders.
Key tasks include:
- Architect and deliver cutting-edge packaging solutions for heterogeneous integration.
- Serve as a solution architect for 3D and 2.5D packaging platforms, resolving system-level packaging challenges from concept design through to prototype and demonstrator builds.
- Lead the definition, design, and development of advanced packaging solutions incorporating substrates, interposers, chiplets, high-density interconnects, microbump/UCIe interfaces, TSVs, and hybrid bonding for various applications including automotive, telecom, and photonics.
- Resolve complex semiconductor packaging challenges from customer requirement analysis to package design, assembly, and validation as a solution architect.
- Support planning and development of technical strategies and roadmaps aligned with Catapult’s themes and technological interests.
- Lead multiple projects simultaneously, working closely with the Project Manager to meet system requirements and customer needs.
- Coordinate technical work packages, interacting with packaging design, substrate, assembly, and thermal teams.
- Engage in hands-on prototyping and lab validation using CSA’s Innovation Centre capabilities.
- Design and develop advanced microelectronics modules/systems and demonstrators using a combination of technologies.
- Provide technical guidance on design, assembly, test, and validation activities, participating in lab activities at CSA Catapult’s Innovation Centre as needed.
- Report technical progress to project teams and broader audiences.
- Consult with Business Development and customers to identify collaborative opportunities.
- Plan projects, estimate resources and budgets, and contribute to bids, proposals, and quotations in collaboration with bid and commercial teams.
- Review technical risk assessments.
- Work with the Head of Packaging to ensure team alignment with company strategy.
- Act as a strategic thinker for developing new and emerging technologies.
- Represent CSA Catapult in collaborative consortia and client engagements, presenting technical strategies and innovation value.
- Participate in bid preparation, resource planning, and stakeholder engagement with business development and commercial teams.
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Principal Packaging Engineer employer: Catapult
Contact Detail:
Catapult Recruiting Team
StudySmarter Expert Advice 🤫
We think this is how you could land Principal Packaging Engineer
✨Tip Number 1
Network with professionals in the semiconductor packaging field. Attend industry conferences, webinars, and workshops to meet potential colleagues and learn about the latest trends and technologies. This can help you gain insights into what CSA Catapult values in their candidates.
✨Tip Number 2
Familiarise yourself with the specific technologies mentioned in the job description, such as 3D and 2.5D packaging, chiplet integration, and high-bandwidth interfaces. Being able to discuss these topics confidently during interviews will demonstrate your expertise and enthusiasm for the role.
✨Tip Number 3
Prepare to showcase your project management skills. Since the role involves leading multiple projects, think of examples from your past experiences where you successfully managed complex tasks and collaborated with diverse teams. This will highlight your ability to meet system requirements and customer needs.
✨Tip Number 4
Engage with CSA Catapult's online presence. Follow them on social media and participate in discussions related to their work. This not only shows your interest in the company but also helps you stay updated on their latest projects and initiatives, which can be useful during interviews.
We think you need these skills to ace Principal Packaging Engineer
Some tips for your application 🫡
Tailor Your CV: Make sure your CV highlights relevant experience in semiconductor packaging, particularly in 3D and 2.5D technologies. Emphasise your leadership roles and any projects that involved advanced interconnects or system-in-package designs.
Craft a Compelling Cover Letter: In your cover letter, express your passion for semiconductor packaging and detail how your expertise aligns with CSA Catapult's goals. Mention specific projects or achievements that demonstrate your ability to lead R&D programmes and collaborate with industry partners.
Showcase Technical Skills: Highlight your technical skills related to packaging solutions, such as experience with chiplet integration, high-density interconnects, and validation activities. Use specific examples to illustrate your problem-solving abilities in complex packaging challenges.
Prepare for Interviews: If invited for an interview, be ready to discuss your previous projects in detail. Prepare to explain your approach to leading teams and managing multiple projects, as well as your vision for future packaging technologies in AI, HPC, and other applications.
How to prepare for a job interview at Catapult
✨Showcase Your Technical Expertise
As a Principal Packaging Engineer, it's crucial to demonstrate your deep understanding of semiconductor packaging technologies. Be prepared to discuss specific projects where you've successfully led the design and development of advanced packaging solutions, particularly in 3D and 2.5D technologies.
✨Highlight Collaborative Experiences
This role involves working with various stakeholders, including global industry and academic partners. Share examples of how you've effectively collaborated on R&D programs or projects, showcasing your ability to lead teams and coordinate technical work packages.
✨Prepare for Problem-Solving Questions
Expect to face questions that assess your problem-solving skills, especially regarding complex semiconductor packaging challenges. Think of specific instances where you resolved issues from concept design through to prototype builds, and be ready to explain your thought process.
✨Demonstrate Strategic Thinking
As a strategic thinker, you'll need to align your technical strategies with the company's goals. Be prepared to discuss how you've developed technology roadmaps in previous roles and how you plan to contribute to CSA Catapult's themes and technological interests.
