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- Tasks: Lead innovative semiconductor packaging projects and develop cutting-edge integration technologies.
- Company: Join CSA Catapult, a leader in R&D for advanced semiconductor solutions.
- Benefits: Competitive salary, professional development, and opportunities to work on groundbreaking technology.
- Why this job: Make a real impact in the future of AI and photonics systems.
- Qualifications: Expertise in microelectronics assembly and semiconductor packaging required.
- Other info: Dynamic team environment with opportunities for mentorship and career growth.
The predicted salary is between 48000 - 72000 £ per year.
CSA Catapult requires a Senior Packaging Process Engineer to work in a challenging R&D environment to explore and develop disruptive semiconductor packaging and integration technologies with a strong background in 3D and 2.5D integration, high-speed interconnects, and advanced semiconductor packaging. This role is pivotal in driving the development of cutting-edge packaging solutions for next-generation systems in AI, co-packaged RF and photonics systems.
The Senior Packaging Process Engineer shall be a subject matter expert/specialist leading a project team of multidisciplinary engineers to deliver complex integration projects, enabling heterogeneous system-in-package (SiP) platforms and performance-optimised device architectures. The Senior Engineer is expected to have expert knowledge in microelectronics assembly and validation, and broad knowledge of semiconductor package engineering, science and technology with prior experience.
They will be applying their knowledge to solve the semiconductor assembly and bonding challenges in advanced packaging of CS products using a wide range of bonding materials. They will support planning projects, bid preparation, technical proposals and quotations, working closely with the bid team and commercial team.
- Lead the development of advanced packaging assembly processes, focusing on 3D/2.5D integration, high-density interposers, and high-speed interconnect solutions (e.g., micro-bumps, hybrid bonding, through-silicon vias).
- Design and validate high-speed interconnect solutions as part of heterogeneous integration and system-in-package (SiP) platforms.
- Define and validate interconnect schemes (fine-pitch flip chip, wafer-level packaging, hybrid bonding) to meet electrical, thermal, and mechanical performance targets.
- Develop robust assembly process flows, including die attach, underfill, bonding, and encapsulation for 3D stacked and interposer-based packages.
- Lead design-for-manufacturing (DFM) activities in collaboration with internal and external design and product development teams.
- Drive technical DOEs, reliability testing, failure analysis, and statistical process control for advanced packaging.
- Interface with technology partners, equipment vendors, and customers to evaluate and implement state-of-the-art materials and tools (e.g., low-loss dielectrics, ultra-fine-pitch interconnects).
- Lead lab-based activities including equipment setup, process characterisation, prototyping, and DOEs using tools such as die bonders, sinter presses, wire bonders, and plasma cleaners.
- Lead project teams, contribute to bid proposals, technical plans, and funding applications.
- Act as a technical authority across multiple packaging projects, mentoring junior engineers and collaborating with cross-functional teams.
- Support the preparation of technical documentation, including work instructions, process flow diagrams, and qualification reports.
- Interface with commercial, R&D, and customer teams to ensure alignment of assembly processes with programme goals.
- Contribute to the development of scale-up plans and futureproofing strategies for process industrialisation and facility readiness.
- Contribute to the strategic roadmap for CSA Catapult’s advanced packaging capability.
- Present results and work to wide audiences to enhance the reputation of the Catapult.
Locations
Senior Packaging Process Engineer in Newport, Wales employer: Catapult
Contact Detail:
Catapult Recruiting Team
StudySmarter Expert Advice 🤫
We think this is how you could land Senior Packaging Process Engineer in Newport, Wales
✨Tip Number 1
Network like a pro! Get out there and connect with industry professionals on LinkedIn or at events. We all know that sometimes it’s not just what you know, but who you know that can land you that dream job.
✨Tip Number 2
Prepare for interviews by researching the company and its projects. We want to see you shine, so practice answering common questions and think about how your experience aligns with their needs. Show them you’re the perfect fit!
✨Tip Number 3
Don’t forget to follow up after interviews! A quick thank-you email can go a long way in keeping you top of mind. We appreciate when candidates show enthusiasm and professionalism.
✨Tip Number 4
Apply through our website for the best chance at landing that role. We love seeing applications come directly from motivated candidates who are eager to join our team and contribute to exciting projects!
We think you need these skills to ace Senior Packaging Process Engineer in Newport, Wales
Some tips for your application 🫡
Show Off Your Expertise: Make sure to highlight your experience in semiconductor packaging and integration technologies. We want to see how your background in 3D and 2.5D integration can contribute to our cutting-edge projects.
Tailor Your Application: Don’t just send a generic CV and cover letter! We love it when applicants customise their applications to reflect the specific skills and experiences that match the Senior Packaging Process Engineer role.
Be Clear and Concise: When writing your application, keep it straightforward. We appreciate clarity, so make sure your achievements and qualifications are easy to read and understand.
Apply Through Our Website: We encourage you to apply directly through our website. It’s the best way for us to receive your application and ensures you’re considered for this exciting opportunity!
How to prepare for a job interview at Catapult
✨Know Your Stuff
Make sure you brush up on your knowledge of 3D and 2.5D integration, high-speed interconnects, and advanced semiconductor packaging. Be ready to discuss specific projects you've worked on that relate to these areas, as this will show your expertise and how it aligns with the role.
✨Showcase Your Leadership Skills
As a Senior Packaging Process Engineer, you'll be leading project teams. Prepare examples of how you've successfully led multidisciplinary teams in the past, focusing on your approach to mentoring junior engineers and collaborating with cross-functional teams.
✨Prepare for Technical Questions
Expect to face technical questions related to microelectronics assembly, bonding challenges, and design-for-manufacturing (DFM) activities. Practise explaining complex concepts clearly and concisely, as this will demonstrate your ability to communicate effectively with both technical and non-technical audiences.
✨Align with Company Goals
Research CSA Catapult's strategic roadmap and recent advancements in semiconductor packaging. Be prepared to discuss how your experience and ideas can contribute to their goals, especially in developing cutting-edge packaging solutions for next-generation systems.