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- Tasks: Lead and design innovative semiconductor packaging solutions for cutting-edge technologies.
- Company: Join CSA Catapult, a leader in semiconductor innovation and collaboration.
- Benefits: Competitive salary, flexible working options, and opportunities for professional growth.
- Why this job: Make a real impact in the tech world by solving complex packaging challenges.
- Qualifications: Expertise in semiconductor packaging and strong project management skills.
- Other info: Dynamic role with hands-on prototyping and collaboration with global partners.
The predicted salary is between 48000 - 72000 £ per year.
CSA Catapult is seeking a Principal Semiconductor Packaging Engineer to lead and architect cutting-edge 3D and 2.5D semiconductor packaging technologies, including advanced interconnects, system-in-package (SiP), chiplet integration, and high-bandwidth interface packaging. This is a strategic technical role combining deep packaging expertise with systems-level design thinking to define and deliver next-generation packaging platforms.
As a senior technical authority, you will lead internal and collaborative R&D programs and interface with global industry and academic partners to deliver packaging solutions for heterogeneous integration, targeting applications in AI, HPC, power electronics, RF, and photonics. You will be expected to provide design expertise on projects, analysis, assembly, and technical guidance on test and validation activities, participating in labs at Catapult’s Innovation Centre.
This position drives all packaging aspects of prototype/product development by charting and enabling packaging technology roadmaps in collaboration with internal and external stakeholders.
Key tasks include:
- Architect and deliver cutting-edge packaging solutions for heterogeneous integration.
- Serve as a solution architect for 3D and 2.5D packaging platforms, resolving system-level packaging challenges from concept design through to prototype and demonstrator builds.
- Lead the definition, design, and development of advanced packaging solutions incorporating substrates, interposers, chiplets, high-density interconnects, microbump/UCIe interfaces, TSVs, and hybrid bonding for various applications including automotive, telecom, and photonics.
- Resolve complex semiconductor packaging challenges from customer requirement analysis to package design, assembly, and validation as a solution architect.
- Support planning and development of technical strategies and roadmaps aligned with Catapult’s themes and technological interests.
- Lead multiple projects simultaneously, working closely with the Project Manager to meet system requirements and customer needs.
- Coordinate technical work packages, interacting with packaging design, substrate, assembly, and thermal teams.
- Engage in hands-on prototyping and lab validation using CSA’s Innovation Centre capabilities.
- Design and develop advanced microelectronics modules/systems and demonstrators using a combination of technologies.
- Provide technical guidance on design, assembly, test, and validation activities, participating in lab activities at CSA Catapult’s Innovation Centre as needed.
- Report technical progress to project teams and broader audiences.
- Consult with Business Development and customers to identify collaborative opportunities.
- Plan projects, estimate resources and budgets, and contribute to bids, proposals, and quotations in collaboration with bid and commercial teams.
- Review technical risk assessments.
- Work with the Head of Packaging to ensure team alignment with company strategy.
- Act as a strategic thinker for developing new and emerging technologies.
- Represent CSA Catapult in collaborative consortia and client engagements, presenting technical strategies and innovation value.
- Participate in bid preparation, resource planning, and stakeholder engagement with business development and commercial teams.
Locations
Principal Packaging Engineer in Newport, Wales employer: Catapult
Contact Detail:
Catapult Recruiting Team
StudySmarter Expert Advice 🤫
We think this is how you could land Principal Packaging Engineer in Newport, Wales
✨Tip Number 1
Network like a pro! Reach out to industry professionals on LinkedIn or at events. We can’t stress enough how important it is to make connections that could lead to job opportunities.
✨Tip Number 2
Show off your skills! Create a portfolio showcasing your past projects and achievements in semiconductor packaging. This will give potential employers a taste of what you can bring to the table.
✨Tip Number 3
Prepare for interviews by brushing up on your technical knowledge and problem-solving skills. We recommend practicing common interview questions related to packaging technologies to boost your confidence.
✨Tip Number 4
Don’t forget to apply through our website! It’s the best way to ensure your application gets noticed. Plus, we love seeing candidates who are proactive about their job search.
We think you need these skills to ace Principal Packaging Engineer in Newport, Wales
Some tips for your application 🫡
Tailor Your CV: Make sure your CV is tailored to the Principal Semiconductor Packaging Engineer role. Highlight your experience with 3D and 2.5D packaging technologies, and don’t forget to mention any relevant projects that showcase your skills in system-level design thinking.
Craft a Compelling Cover Letter: Your cover letter is your chance to shine! Use it to explain why you’re passionate about semiconductor packaging and how your expertise aligns with CSA Catapult’s goals. Be sure to mention specific technologies or projects that excite you.
Showcase Your Technical Expertise: In your application, be sure to highlight your deep packaging expertise and any hands-on experience you have with prototyping and lab validation. This will show us that you’re not just a thinker but also someone who can get things done!
Apply Through Our Website: We encourage you to apply through our website for the best chance of getting noticed. It’s super easy, and you’ll be able to keep track of your application status. Plus, we love seeing applications come directly from our site!
How to prepare for a job interview at Catapult
✨Know Your Packaging Tech Inside Out
Make sure you brush up on the latest trends in 3D and 2.5D semiconductor packaging technologies. Be ready to discuss advanced interconnects, chiplet integration, and system-in-package solutions. Showing that you’re up-to-date with industry advancements will impress your interviewers.
✨Demonstrate Your Design Thinking
Prepare to showcase your systems-level design thinking. Think about how you can articulate your approach to resolving complex packaging challenges. Use specific examples from your past experiences where you led projects from concept to prototype, highlighting your problem-solving skills.
✨Engage with Collaborative Mindset
Since this role involves working with global partners, be ready to discuss your experience in collaborative R&D programs. Share examples of how you’ve successfully coordinated with different teams, and how you’ve contributed to technical strategies that align with broader company goals.
✨Hands-On Experience is Key
Highlight any hands-on prototyping or lab validation experience you have. Discuss specific projects where you engaged in testing and validation activities, as this will show your practical understanding of the packaging processes and your ability to lead technical work packages effectively.