GaN Power Packaging Lead — High-Density, Thermal Expert in Cambridge

A semiconductor company in Cambridge is seeking a Senior/Principal Packaging Engineer to lead the development of high-performance packaging solutions for GaN power products. This role involves collaboration with cross-functional teams, conducting simulations, and overseeing packaging qualifications. Candidates should hold a degree in Engineering or related fields, with strong skills in multiphysics simulation and experience in semiconductor packaging. Join a dynamic team committed to innovation and growth in green technology. #J-18808-Ljbffr