At a Glance
- Tasks: Lead a dynamic team of engineers across Europe and APAC, driving innovation and customer success.
- Company: Join a cutting-edge semiconductor company with a focus on collaboration and growth.
- Benefits: Competitive salary, performance incentives, comprehensive health benefits, and equity options.
- Other info: Opportunity to work with diverse cultures and influence the tech landscape.
- Why this job: Shape the future of technology while mentoring top talent in a fast-paced environment.
- Qualifications: Experience in managing engineering teams and deep knowledge of semiconductor technologies required.
The predicted salary is between 80000 - 100000 £ per year.
Responsibilities
- Lead a distributed team of senior FAEs across EU and APAC.
- Recruit and onboard top-tier engineering talent in key regional hubs.
- Provide continuous technical mentorship and professional development.
- Set clear regional goals aligned with corporate business objectives.
- Create and grow collateral to enable improved efficiency and ease of adoption by the customer (Technical Account Management & Sales Support).
- Partner with regional sales directors to secure high-value design wins.
- Act as the escalation point for critical customer technical issues.
- Oversee customer proof‑of‑concepts, evaluations, and architectural reviews.
- Deliver technical keynotes, deep dives, and product demonstrations to C‑level executives.
- Funnel regional customer requirements directly to internal R&D and Product Management (Product & Ecosystem Collaboration).
- Use market insights to shape the future fabric interconnect IP roadmap (Influence Roadmap).
- Create application notes, whitepapers, and training collateral for regional ecosystems (Enablement).
Qualifications
- Bachelor's degree in Electrical Engineering, Computer Engineering, or related STEM field.
- 5+ years of experience managing customer‑facing engineering teams (FAE or Technical Support).
- 10+ years in semiconductor, silicon IP, or high‑performance networking sectors.
- Deep understanding of Network‑on‑Chip (No C), AMBA protocols (CHI, AXI, ACE), PCIe/CXL fabrics.
- Familiarity with front‑end ASIC design, So C architecture, RTL verification, and EDA tools (Synopsys, Cadence, Siemens).
- Insight into AI/ML accelerators, data center architectures, and automotive So C requirements.
- Exceptional English verbal and written communication skills.
- Proven experience managing teams and clients across diverse cultures in Europe and Asia.
- Self‑motivated, suited for fast‑paced, early‑stage startup environment.
- Preferred Master's or Ph. D. in Electrical or Computer Engineering.
- Prior experience in fast‑growing, venture‑backed silicon IP startup.
- Existing technical relationships with major Tier‑1 semiconductor and system companies in EU and APAC.
- Additional language skills relevant to covered regions (Mandarin, Japanese, Korean, German).
Benefits
- Salary commensurate with experience.
- Performance incentives.
- Comprehensive medical, dental, and vision benefits.
- 401(k) retirement plan.
- Equity.
We are an equal opportunity employer. All qualified applicants will receive equal consideration for employment.
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Manager of Field Applications Engineering- Europe and APAC in Newtown employer: Baya Systems
As a leading player in the semiconductor industry, we pride ourselves on being an excellent employer that fosters a dynamic and inclusive work culture. Our commitment to employee growth is evident through continuous technical mentorship and professional development opportunities, ensuring that our team members thrive in their careers. With competitive benefits, including performance incentives and equity options, along with the chance to work in key regional hubs across Europe and APAC, we offer a rewarding environment for those looking to make a significant impact in a fast-paced, innovative setting.
