Director of Field Applications Engineering- Europe and APAC in Cambridge

Director of Field Applications Engineering- Europe and APAC in Cambridge

Cambridge Full-Time 100000 - 150000 £ / year (est.) No working from home possible
Baya Systems

At a Glance

  • Tasks: Lead a dynamic team to drive technical adoption and design wins in semiconductor solutions.
  • Company: Join Baya Systems, a fast-moving startup revolutionising intelligent computing.
  • Benefits: Competitive salary, performance incentives, comprehensive benefits, and equity options.
  • Other info: Remote role with international travel opportunities and excellent career growth.
  • Why this job: Make a real impact in the semiconductor industry while leading innovative projects.
  • Qualifications: 10+ years in semiconductor with strong leadership and technical expertise.

The predicted salary is between 100000 - 150000 £ per year.

Baya Systems is inspired by the baya bird , also known as the weaver . Baya birds weave very unique and intricate hanging nests from different materials. The nests are robust and safe while being extremely lightweight and efficient.

Baya is a fast-moving Series B startup built by serial entrepreneurs with a vision to accelerate intelligent computing in the emerging chiplet era.

We focus on software-driven, unified fabric solutions for single-die and multi-die systems.

We design and license disruptive intellectual property for use in semiconductor chips, with software development platforms to simplify the design process and reduce the time to market for complex System-on-Chip (So C) and multi-chiplet systems.

This enables our partners to innovate and deliver compelling solutions for data center, infrastructure, AI, Automotive, and Edge Io T markets.

We are looking for energetic and dedicated individuals share our passion for enabling innovation and excellence in the semiconductor industry that empowers game-changing products and services!

Director, Field Applications Engineering (UK/EU/APAC)

Role Overview

Lead and grow a world-class Field Applications Engineering (FAE) team across Europe and the Asia-Pacific region.

You will drive the technical adoption, integration, and design-win pipeline for our next-generation fabric interconnect silicon IP.

You will be responsible for both Pre AND Post sales support.

  • Position: Director, Field Applications Engineering
  • Location: Remote (Based in the EU or the UK)
  • Region Coverage: Europe (EU) and Asia-Pacific (APAC)
  • Travel: Up to 30-40% international travel required

Key Responsibilities

  • Team Leadership & Development
  • Manage: Lead a distributed team of senior FAEs across EU and APAC.
  • Hire: Recruit and onboard top-tier engineering talent in key regional hubs.
  • Coach: Provide continuous technical mentorship and professional development.

Align: Set clear regional goals aligned with corporate business objectives.

  • Grow collaterals , to enable improved efficiency / easy of adoption by the customer
  • Technical Account Management & Sales Support
  • Drive Strategy: Partner with regional sales directors to secure high-value design wins.
  • Own Delivery: Act as the escalations point for critical customer technical issues.
  • Guide Evaluation: Oversee customer proof-of-concepts, evaluations, and architectural reviews.
  • Present: Deliver technical keynotes, deep-dives, and product demonstrations to C-level executives.
  • Product & Ecosystem Collaboration
  • Feedback Loop: Funnel regional customer requirements directly to internal R&D and Product Management.
  • Influence Roadmap: Use market insights to shape the future fabric interconnect IP roadmap.
  • Enablement: Create application notes, whitepapers, and training collateral for regional ecosystems.
  • Required Qualifications

Experience & Education

  • Education: Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related STEM field.
  • Management: 5+ years of experience managing customer-facing engineering teams (FAE or Technical Support).
  • Industry: 10+ years in the semiconductor, silicon IP, or high-performance networking sectors.
  • Technical Expertise
  • IP Knowledge: Deep understanding of Network-on-Chip (No C), AMBA protocols (CHI, AXI, ACE), or PCIe/CXL fabrics.
  • Design Flow: Familiarity with front-end ASIC design, So C architecture, RTL verification, and EDA tools (Synopsys, Cadence, Siemens).
  • Systems: Insight into AI/ML accelerators, data center architectures, and automotive So C requirements.
  • Soft Skills & Logistics
  • Communication: Exceptional English verbal and written communication skills.
  • Cross-Cultural: Proven experience managing teams and clients across diverse cultures in Europe and Asia.
  • Autonomy: Self-motivated style suited for a fast-paced, early-stage startup environment. [ 1 ]
  • Preferred Qualifications
  • Master’s degree or Ph D in Electrical or Computer Engineering.
  • Prior experience working in a fast-growing, venture-backed silicon IP startup.
  • Existing technical relationships with major Tier-1 semiconductor and system companies in the EU and APAC.
  • Additional language skills relevant to the covered regions (e. g., Mandarin, Japanese, Korean, German).

Compensation

  • Salary commensurate with experience
  • Performance incentives
  • Comprehensive medical, dental, and vision benefits
  • 401(k) retirement plan
  • Equity

Director of Field Applications Engineering- Europe and APAC in Cambridge employer: Baya Systems

Baya Systems is an exceptional employer that fosters a dynamic and innovative work culture in Newtown, UK. With a focus on employee growth, we offer extensive training opportunities and performance incentives, ensuring our team thrives in a fast-paced startup environment. Join us to be part of a collaborative team dedicated to solving customer challenges in the semiconductor industry while enjoying comprehensive health benefits.

Baya Systems

Contact Details:

Baya Systems Recruitment Team

We think you need these skills to ace Director of Field Applications Engineering- Europe and APAC in Cambridge

Team Leadership
Technical Mentorship
Customer Technical Support
Design-Win Strategy
Technical Account Management
Network-on-Chip (NoC) Knowledge
AMBA Protocols (CHI, AXI, ACE)