Senior Advanced Packaging & PDN Architect (2.5D/3D) in Bristol

Senior Advanced Packaging & PDN Architect (2.5D/3D) in Bristol

Bristol Full-Time 60000 - 80000 Β£ / year (est.) No working from home possible
Axelera AI

At a Glance

  • Tasks: Lead the design of advanced packaging and power delivery for cutting-edge AI accelerators.
  • Company: Join Axelera AI, a leader in innovative semiconductor technology.
  • Benefits: Enjoy flexible working arrangements, including remote options, and competitive salary.
  • Other info: Collaborative environment with opportunities for professional growth.
  • Why this job: Shape the future of AI technology and work on groundbreaking projects.
  • Qualifications: Degree in relevant field with 7+ years in power delivery and packaging design.

The predicted salary is between 60000 - 80000 Β£ per year.

Axelera AI is seeking a Senior Advanced Packaging & Power Delivery Engineer to shape the silicon architecture of AI accelerators. This role involves overseeing power delivery design and advancing packaging technologies. You will collaborate closely with cross-functional teams to ensure product alignment and performance.

The ideal candidate should possess a relevant degree and have over 7 years of experience in power delivery and packaging design in the semiconductor field. Flexible working arrangements are available, including remote options.

Senior Advanced Packaging & PDN Architect (2.5D/3D) in Bristol employer: Axelera AI

Axelera AI is an exceptional employer, offering a unique opportunity to work at the forefront of AI technology in a dynamic and inclusive environment. With flexible working arrangements across multiple European locations, employees benefit from a strong culture of collaboration, creativity, and innovation, alongside an attractive compensation package that includes pension plans and company shares. Join a world-class team dedicated to advancing humanity and making a meaningful impact through cutting-edge AI solutions.

Axelera AI

Contact Details:

Axelera AI Recruitment Team

We think you need these skills to ace Senior Advanced Packaging & PDN Architect (2.5D/3D) in Bristol

Silicon Architecture Design
Power Delivery Design
Packaging Technologies
Cross-Functional Collaboration
Semiconductor Experience
Product Alignment
Performance Optimisation