Process Integration Engineer (SANTA CLARA)

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT.

You'll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company.

At Applied Materials, we care about the health and wellbeing of our employees. We're committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go.

The successful candidate will be responsible for:

• Developing new modules leveraging Applied's wide equipment portfolio and advising the packaging Business Unit on equipment requirements for Advanced semiconductor packaging.
• Filing for IP on new patentable developments.
• Domain expertise in advanced packaging areas such as W2W/D2W bonding, micro bumps, TSV, thermal management, optics and multi-wafer stacking with deep understanding of materials, process, device physics and integration.
• Driving new materials and process development to enable new inflections in logic, DRAM and NAND through structured problem-solving methodology.
• Solving complex problems through innovation and ideation of novel approaches.
• Acting as engineering expert in semiconductor packaging and driving cross-functional projects by working with engineers, managers and directors across Applied's business units.
• Structuring and maintaining Applied's roadmap in Packaging modules and how it fits within advanced modules with the industry.
• Designing experiments to improve packaging wiring performance, by reducing RC delays and increasing wiring density in various dielectrics.
• Representing Integration Module Solutions (IMS) as a module specialist to various business units within Applied and to customers.
• Defining engineering plans, designing DOEs, helping characterise and create engineering reports for advanced packaging.
• Creating roadmap committees for some packaging applications and shepherding Applied's product portfolio.

Minimum qualifications include:

• BS/MS in Electrical, Mechanical Engineering, Material Engineering or equivalent.
• 10 years of experience in semiconductor packaging development and manufacturing.
• Strong communication skills to effectively deal with Business Units, cross-functional teams, internal or external manufacturing and customers.
• Ability to lead projects across organisation and culture in a fast-paced environment.
• Self-starter, team player and able to work independently with minimal supervision.

Position requires understanding of Applied Materials global Standards of Business Conduct and compliance with these standards at all times, demonstrating the highest level of ethical conduct reflecting Applied Materials' core values.

Additional Information:

• Time Type: Full time
• Employee Type: Assignee / Regular
• Travel: Yes, 20% of the Time
• Relocation Eligible: Yes

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, colour, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.