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- Tasks: Design and manufacture high-performance GPUs, tackling complex engineering challenges.
- Company: Join Apple, a leader in innovative technology with a diverse and inclusive culture.
- Benefits: Competitive salary, health benefits, and opportunities for professional growth.
- Why this job: Be part of a team that creates technology loved by millions worldwide.
- Qualifications: MSEE or equivalent with deep ASIC integration experience required.
- Other info: Dynamic work environment with a focus on collaboration and innovation.
The predicted salary is between 36000 - 60000 ÂŁ per year.
Do you love creating sophisticated solutions to highly complex challenges? As part of our Silicon Technologies group, you’ll help design and manufacture our next-generation, high-performance, power-efficient GPU. You’ll ensure Apple products and services can seamlessly and expertly handle the tasks that make them beloved by millions. Joining this group means crafting and building the technology that fuels Apple’s devices. Together, we enable our customers to do all the things they love with their devices!
This role requires a mix of strategic engineering along with hands-on, technical work, being responsible for implementing complete chip design from netlist to tapeout, and having hands-on experience in physical design and large chip integration.
Responsibilities- Collaborate with FE team to understand chip architecture and drive physical aspects early in design cycle.
- Contribute to innovation with the physical design team, and develop methodologies and “best known methods” that will enable outstanding GPU design.
- Develop PD guidelines and checklists and drive execution. Be the focal point for place and route integration at the top level.
- Plan short and long-term work and goals with awareness of dependencies between different domains like top, STA, block place and route.
- Reach new career highs as you resolve design and flow issues related to physical design, identify potential solutions and drive execution.
If you are a confident problem solver who thrives under pressure to find new, creative solutions, we are excited to hear from you!
Minimum Qualifications- MSEE or equivalent is required.
- Deep experience with all aspects of ASIC integration including Floorplanning, Clock & Power distribution, global signal planning, I/O planning & hard IP integration.
- Knowledge of issues such as multiple voltage and clock domains, ESD strategies, mixed signal block integration, and package interactions.
- Familiar with hierarchical design approach, top-down design, budgeting, timing and physical convergence.
- Depth of expertise on integrating IP from both internal and external vendors and be able to specify and drive IP requirements in the physical domain.
- Experience with large subsystem designs (>20M gates) with frequencies in excess of 1GHz applying brand-new technologies.
- Familiar with various process related design issues including Design for Yield and Manufacturability, multi Vt strategies and thermal Mgt.
- From a CAD tool perspective, experience with Floorplanning tools, P&R flows, global timing verification and Physical Design Verification Flows is required.
At Apple, we’re not all the same. And that’s our greatest strength. We draw on the differences in who we are, what we’ve experienced and how we think. Because to create products that serve everyone, we believe in including everyone. Therefore, we are committed to treating all applicants fairly and equally. As a registered Disability Confident employer, we will work with applicants to make any reasonable accommodations. Apple will consider for employment all qualified applicants with criminal backgrounds in a manner consistent with applicable law.
GPU Top Level Physical Design Engineer (M, F, D) in Cambridge employer: Apple
Contact Detail:
Apple Recruiting Team
StudySmarter Expert Advice 🤫
We think this is how you could land GPU Top Level Physical Design Engineer (M, F, D) in Cambridge
✨Tip Number 1
Network like a pro! Reach out to folks in the industry, attend meetups, and connect with current employees at Apple. A friendly chat can sometimes lead to opportunities that aren’t even advertised!
✨Tip Number 2
Show off your skills! Create a portfolio or a project that highlights your expertise in GPU design and physical integration. This hands-on evidence can really set you apart during interviews.
✨Tip Number 3
Prepare for technical interviews by brushing up on your ASIC integration knowledge. Practice explaining complex concepts clearly and confidently, as this will showcase your problem-solving abilities.
✨Tip Number 4
Don’t forget to apply through our website! It’s the best way to ensure your application gets seen by the right people. Plus, it shows you’re genuinely interested in joining the team!
We think you need these skills to ace GPU Top Level Physical Design Engineer (M, F, D) in Cambridge
Some tips for your application 🫡
Show Your Passion: When writing your application, let your enthusiasm for GPU design shine through! We want to see how much you love tackling complex challenges and creating innovative solutions. Make sure to highlight any relevant projects or experiences that showcase your passion.
Tailor Your CV: Don’t just send out the same CV for every job! Take a moment to tailor your CV to match the specific requirements of the GPU Top Level Physical Design Engineer role. We’re looking for skills in ASIC integration and physical design, so make sure those stand out in your application.
Be Clear and Concise: Keep your application clear and to the point. We appreciate well-structured applications that are easy to read. Use bullet points where possible to break down your experience and skills, making it easier for us to see why you’d be a great fit!
Apply Through Our Website: We encourage you to apply directly through our website. It’s the best way for us to receive your application and ensures you’re considered for the role. Plus, it gives you a chance to explore more about what we do at StudySmarter!
How to prepare for a job interview at Apple
✨Know Your Stuff
Make sure you brush up on your ASIC integration knowledge, especially around Floorplanning and Clock & Power distribution. Be ready to discuss specific projects where you've tackled these challenges, as it shows you're not just familiar with the theory but have practical experience too.
✨Show Your Problem-Solving Skills
Prepare examples of how you've resolved design and flow issues in past projects. Highlight your creative solutions and how they contributed to the overall success of the project. This will demonstrate your ability to thrive under pressure, which is key for this role.
✨Understand the Bigger Picture
Familiarise yourself with the chip architecture and how different domains interact. Being able to discuss dependencies between top, STA, and block place and route will show that you can think strategically about the design process.
✨Be Ready to Collaborate
This role involves a lot of teamwork, so be prepared to talk about your experience working with cross-functional teams. Share how you've collaborated with others to drive physical aspects early in the design cycle, as this will highlight your ability to work well with the FE team and contribute to innovation.
