IBM Hardware Engineer - Contract Opportunity, HCD, IODF, HMC, Hybrid
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IBM Hardware Engineer - Contract Opportunity, HCD, IODF, HMC, Hybrid

IBM Hardware Engineer - Contract Opportunity, HCD, IODF, HMC, Hybrid

Sheffield Temporary 42000 - 84000 £ / year (est.) No home office possible
Apply now
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At a Glance

  • Tasks: Join us to build and configure cutting-edge z16 machines while collaborating with a dynamic team.
  • Company: Be part of IBM, a global leader in technology and innovation.
  • Benefits: Enjoy a hybrid work model with 3 days on-site and 2 days remote each week.
  • Why this job: This role offers hands-on experience with advanced hardware and the chance to grow your tech skills.
  • Qualifications: Knowledge of Mainframe hardware and configuration activities is essential; troubleshooting skills are a plus.
  • Other info: Initial contract of 6-12 months with potential for extensions.

The predicted salary is between 42000 - 84000 £ per year.

A large global organisation are seeking an IBM Hardware Engineer to build and configure new z16 machines with assisted documentation. This will be an initial 6-12 months+ contract with the opportunity for extensions. The position will be worked on a Hybrid/Remote basis, 3 days a week on site in Sheffield and 2 days worked remotely.

Key Responsibilities/Skills:

  • Full time Hardware Engineer
  • Assist in z14 to z16 model migration activities.
  • Good knowledge on managing Mainframe hardware models with HCD, IODF, HMC configuration activities.
  • Oversee racking, stacking, channel configuration and powering of equipment in DC.
  • Able to troubleshoot issues and work with extended teams.

IBM Hardware Engineer - Contract Opportunity, HCD, IODF, HMC, Hybrid employer: MRP Technology Ltd

As a leading global organisation, we pride ourselves on fostering a dynamic work culture that values innovation and collaboration. Our Sheffield location offers a hybrid working model, allowing you to enjoy the flexibility of remote work while also benefiting from in-person teamwork three days a week. With ample opportunities for professional growth and development, joining us as an IBM Hardware Engineer means being part of a supportive environment where your contributions are recognised and rewarded.
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Contact Detail:

MRP Technology Ltd Recruiting Team

StudySmarter Expert Advice 🤫

We think this is how you could land IBM Hardware Engineer - Contract Opportunity, HCD, IODF, HMC, Hybrid

✨Tip Number 1

Familiarise yourself with IBM's z16 architecture and its features. Understanding the specifics of z14 to z16 migration will give you an edge during discussions with potential employers.

✨Tip Number 2

Network with professionals in the IBM hardware community. Join relevant forums or LinkedIn groups where you can connect with current IBM engineers and learn about their experiences and insights.

✨Tip Number 3

Brush up on your troubleshooting skills, especially related to mainframe hardware. Being able to demonstrate your problem-solving abilities in real-time scenarios can set you apart from other candidates.

✨Tip Number 4

Prepare for hybrid work by ensuring you have a suitable home office setup. Highlight your ability to work independently and manage your time effectively, as this is crucial for remote days.

We think you need these skills to ace IBM Hardware Engineer - Contract Opportunity, HCD, IODF, HMC, Hybrid

IBM Mainframe Hardware Knowledge
HCD (Hardware Configuration Definition)
IODF (Input/Output Device Configuration)
HMC (Hardware Management Console) Configuration
z14 to z16 Migration Experience
Data Centre Equipment Racking and Stacking
Channel Configuration
Powering of Equipment in Data Centres
Troubleshooting Skills
Collaboration with Extended Teams
Documentation Skills
Adaptability to Hybrid Work Environment
Attention to Detail
Problem-Solving Skills

Some tips for your application 🫡

Tailor Your CV: Make sure your CV highlights relevant experience in hardware engineering, particularly with IBM systems like z14 and z16. Emphasise your skills in HCD, IODF, and HMC configuration to align with the job requirements.

Craft a Compelling Cover Letter: Write a cover letter that showcases your passion for hardware engineering and your specific experience with mainframe hardware. Mention any previous contract roles and how they have prepared you for this position.

Highlight Key Skills: In your application, clearly outline your troubleshooting abilities and experience working with extended teams. Use specific examples to demonstrate how you've successfully managed similar tasks in past roles.

Proofread Your Application: Before submitting, carefully proofread your application for any spelling or grammatical errors. A polished application reflects your attention to detail, which is crucial for a technical role like this.

How to prepare for a job interview at MRP Technology Ltd

✨Show Your Technical Expertise

Make sure to brush up on your knowledge of HCD, IODF, and HMC configurations. Be prepared to discuss specific experiences you've had with z14 to z16 migrations and any troubleshooting you've done in the past.

✨Demonstrate Problem-Solving Skills

During the interview, be ready to share examples of how you've tackled hardware issues in the past. Highlight your ability to work collaboratively with extended teams to resolve complex problems.

✨Understand the Hybrid Work Model

Since this role involves a hybrid working arrangement, express your comfort and experience with remote collaboration tools. Discuss how you manage your time and productivity when working from home.

✨Prepare Questions About the Role

Have a few insightful questions ready about the company's approach to hardware engineering and the specific challenges they face. This shows your genuine interest in the position and helps you assess if it's the right fit for you.

IBM Hardware Engineer - Contract Opportunity, HCD, IODF, HMC, Hybrid
MRP Technology Ltd
Apply now
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  • IBM Hardware Engineer - Contract Opportunity, HCD, IODF, HMC, Hybrid

    Sheffield
    Temporary
    42000 - 84000 £ / year (est.)
    Apply now

    Application deadline: 2027-04-17

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    MRP Technology Ltd

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